Advanced Packaging Webinar Series (Part III) – PVD Processes for UBM/RDL
In the third and final part of our webinar series on the various wafer level processes that are enabling the implementation of a range of different “advanced” packaging solutions, this 35-40 min presentation will describe recent developments in this market and focus on the challenges and solutions for metal deposition using physical vapor deposition (PVD) in specific applications.
With the adoption of organic materials for passivation and substrate materials (e.g. epoxy mold in FO-WLP) the technical challenges for under-bump metal (UBM) and redistribution layer (RDL) deposition are predominantly in the areas of pre-treatment, becoming even more challenging as line/space dimensions reduce to increase I/O density, improve device performance, and reduce form factor.
This webinar will explain some unique features of SPTS’s Sigma® fxP that offers low and stable contact resistance (Rc), whilst delivering CoO advantages over other PVD systems, with hardware options tailored specifically for BEOL users, where CoO, throughput and yield are critical.
Registration is required for this online event :
Date: Wednesday 10th November 2021
Session 1: 08:00am UK (BST) / 09:00am Europe / 16:00pm China & Taiwan / 17:00pm Korea
Repeat Session: 09:00am PST / 12:00pm EST / 17:00pm UK / 18:00pm Europe
N.B. The same content will be shared in both live broadcasts, listed above, to accommodate all time zones.
Presenter: Chris Jones, Senior Director, PVD Product Management
Chris Jones is Senior Director for PVD Product Management. He is responsible for the SPTS PVD product line covering all aspects of marketing including product positioning and the provision of support to the worldwide sales team.
After completing his BEng in Mechanical Engineering in 1995 at the University of Bristol, UK, he joined SPTS working in Field Service and then Process Engineering before moving into Product Management in 2004. Chris has presented widely on SPTS products and is an author of several technical articles.